Kucetyiswa ukuba imingxuma yangaphandle yesandi kuyo yonke imeko ibe kufutshane ne-MIC ngokusemandleni, enokwenza lula ukuyila kwee-gaskets kunye nezakhiwo ezinxulumene nomatshini.Ngelo xesha, umngxuma wesandi kufuneka ugcinwe kude kangangoko kunokwenzeka kwizithethi kunye neminye imithombo yengxolo ukunciphisa impembelelo yale miqondiso engadingekile kwigalelo le-MIC.
Ukuba ii-MICs ezininzi zisetyenziselwa ukuyila, ukhetho lwe-MIC yesithuba somngxuma wesandi lukhawulelwe kakhulu yimo yesicelo semveliso kunye nokusetyenziswa kwe-algorithm.Ukukhetha indawo ye-MIC kunye nomngxuma wayo wesandi kwangethuba kwinkqubo yoyilo kunokuthintela umonakalo obangelwe lutshintsho lwamva lwecasing.Iindleko zotshintsho lwesekethe yePCB.
uyilo lwetshaneli yesandi
Ijiko lokuphendula rhoqo le-MIC kuyilo lomatshini lonke lixhomekeke kwigophe lokuphendula rhoqo le-MIC ngokwayo kunye nemilinganiselo yomatshini yenxalenye nganye yesitishi sokungenisa isandi, kubandakanywa nobungakanani bomngxuma wesandi kwi-casing, ubukhulu igasket kunye nobukhulu bokuvulwa kwePCB.Ukongeza, akufuneki kubekho ukuvuza kwitshaneli yokungenisa isandi.Ukuba kukho ukuvuza, kuya kubangela lula iingxaki ze-echo kunye nengxolo.
Umjelo omfutshane kunye nobubanzi bokufaka umjelo unempembelelo encinci kwi-MIC frequency response curve, ngelixa ijelo elide kunye nelincinci lokufaka ijelo linokuvelisa iincopho ze-resonance kwi-audio frequency range, kunye noyilo oluhle lokufakela umjelo unokufezekisa isandi esisicaba kuluhlu lomsindo.Ke ngoko, kucetyiswa ukuba umyili alinganise ijika lokuphendula rhoqo le-MIC kunye ne-chassis kunye nejelo lokungena elivakalayo ngexesha loyilo ukuze agwebe ukuba umsebenzi uyahlangabezana neemfuno zoyilo.
Kuyilo usebenzisa isandi sangaphambili se-MEMS MIC, ububanzi bokuvulwa kwe-gasket kufuneka bube yi-0.5mm enkulu kunobubanzi bomngxuma wesandi we-microphone ukuphepha impembelelo yokutenxa kokuvulwa kwe-gasket kunye indawo yokubeka ku-x kunye no-y, kunye nokuqinisekisa ukuba i-gasket isebenza njengesitywini.Ngomsebenzi we-MIC, i-diameter yangaphakathi ye-gasket akufanele ibe nkulu kakhulu, nakuphi na ukuvuza kwesandi kunokubangela i-echo, ingxolo kunye neengxaki zokuphendula rhoqo.
Kuyilo kusetyenziswa isandi esingasemva (ubude be-zero) i-MEMS MIC, isitishi sokungenisa isandi sibandakanya umsesane we-welding phakathi kwe-MIC kunye ne-PCB yomatshini wonke kunye nomngxuma kwi-PCB yomatshini wonke.Umngxuma wesandi kwi-PCB yomatshini wonke kufuneka ube mkhulu ngokufanelekileyo ukuqinisekisa ukuba awuchaphazeli ijika lempendulo ye-Frequency, kodwa ukuze kuqinisekiswe ukuba indawo ye-welding yeringi yomhlaba kwi-PCB ayinkulu kakhulu, kucetyiswa ukuba ububanzi bePCB yokuvulwa komatshini wonke ukusuka ku-0.4mm ukuya kwi-0.9mm.Ukuze uthintele i-solder paste ekunyibilikeni kumngxunya wesandi kunye nokuthintela umngxuma wesandi ngexesha lenkqubo yokubuyisela kwakhona, umngxuma wesandi kwi-PCB awukwazi ukuba yintsimbi.
I-Echo kunye noLawulo lweNgxolo
Uninzi lweengxaki ze-echo zibangelwa kukutywinwa kakubi kwe-gasket.Ukuvuza kwesandi kwi-gasket kuya kuvumela isandi sesigodlo kunye nezinye izandi ukuba zingene ngaphakathi kwimeko kwaye zithathwe yi-MIC.Iya kubangela ingxolo yomsindo eyenziwe yeminye imithombo yengxolo ukuba ithathwe yi-MIC.I-echo okanye iingxaki zengxolo.
Ngeecho okanye iingxaki zengxolo, kukho iindlela ezininzi zokuphucula:
A. Nciphisa okanye unciphise i-amplitude yomqondiso wesiphumo sesithethi;
B. Ukwandisa umgama phakathi kwesithethi kunye ne-MIC ngokutshintsha indawo yesithethi de i-echo iwela kuluhlu olwamkelekileyo;
C. Sebenzisa isoftware ekhethekileyo yokurhoxiswa kwe-echo ukususa isiginali yesithethi kwisiphelo seMIC;
D. Nciphisa inzuzo ye-MIC yangaphakathi ye-baseband chip okanye i-chip engundoqo ngokusebenzisa izicwangciso zesofthiwe
Ukuba ufuna ukwazi ngakumbi, nceda ucofe iwebhusayithi yethu: https://www.romanearbuds.com,
Ixesha lokuposa: Jul-07-2022
